Kon DuxRoHS Compliant!
This item is factory applied only.
Kon-Dux interface pads are a cost-effective alternative to thermally conductive grease compounds. Aavid pre-applies Kon-Dux to your heat sink to enhance heat conductance from the semiconductor case and speed your manufacturing process. Kon-Dux pads are the equivalent of Softface for low-volume applications. This material is ideal for use with small, discrete semiconductors.
To order, indicate the appropriate ordering code in the 8th position of the part number. The shape and hole pattern of the heat sink will determine the shape and hole pattern of the pad. If you are ordering a heat sink which mounts a semiconductor on both sides, the ordering code for two pads should be used.
8th position ordering codes
0 = No Pads
1 = One Kon-Dux Pad
2 = Two Kon-Dux Pads
|15 x 10-6 Ohms|
for 10% reduction in thickness
|Tensile Strength||650 psi|
|Service Temperature||-240°C to +300°C|
Grafoil® Conducta-PadRoHS Compliant!
Grafoil® is a non-insulating material which reduces interface thermal resistance in a bare joint application. A dry material, basically a graphite compound, Grafoil® was originally developed for high temperature gasketing applications and is covered by U.S. Patent 3,404,061 granted to Union Carbide. Basic shapes in stock are designed to accomodate TO-3,TO-218,TO-220, and Multiwatt case styles.Grafoil® is factory applied to the heat sink and is available on all stamped and extruded models.
|Suffix||Device||Figure||"A" Dim||"B" Dim||"C" Dim||"D" Dim||"E" Dim||"F" Dim|
|G4||TO-218||B||19.30 (0.760)||4.83 (0.190)||7.87 (0.310)||15.75 (0.620)||3.81 (0.150)||0.13 (0.005)|
|G5||TO-220||B||16.51 (0.650)||3.43 (0.135)||5.33 (0.210)||10.67 (0.420)||3.43 (0.135)||0.13 (0.005)|
|G7||Multiwatt||B||17.53 (0.690)||2.92 (0.115)||10.03 (0.395)||20.07 (0.790)||3.81 (0.150)||0.13 (0.005)|
Grafoil® is a registered trademark of GrafTech International Holdings Inc.
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