High rise style heat sink features twisted fins and solderable Wave On mounts and device clip
This non-electronic component is functionally unaffected by the normal soldering or reflow processes used for semiconductor circuits. The heat resistance time or heat resistance temperature is not applicable for the component.
Additional Drawing Dimensions:
A Dim: 21.8
X Dim: 12.07 (0.475) | Y Dim: 6.35 (0.250) | YT Dim: 12.70 (0.500) | Z Dim: 4.75 (0.187)