Technical Papers

thermal design and analysis
July 2015
Aavid's CTO Sukhvinder Kang and Design Engineer Kayvan Abbasi published a paper on Temperature depression under heat sources with cylindrical contact thermocouples

Paper (PDF)
Presentation (PDF)



April 2015
Adriana Druma of Aavid's Design Center presented Computer modeling of transport phenomena in RF ablation applicator

Presentation



March 2012
Advanced Cooling for Power Electronics

Paper (PDF)



April 2011
Cooling to keep your Key Chips Alive

Paper (PDF)
Presentation (PDF)



Fall 2010
Evaluation of Cooling Solutions for Outdoor Electronics. Electronics Cooling Magazine, Volume 16, Number 3

Paper (PDF)



June 2010
Computational Method for Generalized Analysis of Pumped Two-Phase Cooling Systems and its Application to a System Used in Data-Center Environments. Proceedings of ITherm 2010 Conference

Paper (PDF)



July 2008
Flat Plate Evaporator for Electronic Cooling. 6th International Energy Conversion Engineering Conference, Cleveland, Ohio, USA

Paper (PDF)



May 2008
Loop Heat Pipe Technology for Cooling Computer Servers. Proceedings of ITherm 2008 Conference

Paper (PDF)



September 2007
Evaluation of Cooling Solutions for Outdoor Electronics. Proceedings of Therminic 2007 Conference, Budapest, Hungary

Paper (PDF)



July 2007
Read about the latest cooling technologies for high heat flux applications in this paper given by Aavid's chief technology officer Sukhvinder Kang at InterPACK 2007 in Vancouver.
CLOSED LOOP LIQUID COOLING FOR HIGH PERFORMANCE COMPUTER SYSTEMS

Paper (PDF)



July 2007
Surface Mount Technology Cooling for High Volume Applications. SIA-APE Conference, Paris, France

Paper (PDF)



June 2006
Effect Of Obstruction Near Fan Inlet On Fan Heat Sink Performance. Proceedings of Itherm 2006 Conference, San Diego, California, USA

Paper (PDF)



July 2005
Testing the Thermal Resistance and Power Capacity of Production Heat Pipes. Proceedings of IPACK 2005, San Francisco, California, USA

Paper (PDF)



July 2005
Computational Method for Characterization of a Microchannel Heat Sink Involving Two-Phase Flow. Proceedings of IPACK 2005, San Francisco, California, USA 2.6 mb

Paper (PDF)



July 2005
Bonding and Brazing Technologies for Power Electronic Cooling – When and Why

Paper (PDF)



July 2004
Blister Liquid Cold Plates–Production Technology; Thermal Performances Analysis and Application Comparisons. PCIM, Nuremberg, Germany

Paper (PDF)



June 2004
Board Level Thermal Analysis via Large Eddy Simulation (LES) Tool. Proceedings of ITherm 2004 Conference

Paper (PDF)



July 2003
Advanced Cooling Methods for High Power Density in Electronics

Paper (PDF)



July 2003
The Thermal Resistance of Pin Fin Heat Sinks in Transverse Flow. Proceedings of IPACK 2003, Maui, Hawaii, USA

Paper (PDF)



April 2003
Learn about some of the latest cooling solutions offered by Aavid Thermalloy for all new modules with high power density.

Paper (PDF)



June 2002
A Simplified CFD Model for the Radial Blower. Proceedings of ITherm 2002 Conference, San Diego, California, USA

Paper (PDF)



June 2001
High Performance SOI/Cu SRAMs and Memories in Microprocessors. Advanced Interconnect Conference, Montreal, Canada

Paper (PDF)


Analytical Model for Simulating the Thermal Behavior of Microelectronic Systems 361k

Paper (PDF)


Analytical Modeling of Thermal Resistance in Bolted Joints 267k

Paper (PDF)


Closed-Form Equation for Thermal Constriction/Spreading Resistances with Variable Resistance Boundary Condition 367k

Paper (PDF)


Constriction/Spreading Resistance Model for Electronics Packaging 425k

Paper (PDF)


How to Select a Heat Sink 212k

Paper (PDF)


Optimum Design and Selection of Heat Sinks 249k

Paper (PDF)


Thermal Modeling of Isothermal Cuboids and Rectangular Heat Sinks Cooled by Natural Convection 316k

Paper (PDF)


Thermal Performance of an Elliptical Pin Fin Heat Sink 317k

Paper (PDF)


Thermal Performance of Interface Material in Microelectronics Packaging Applications

Paper (PDF)


Thermal Performance Modeling and Measurements of Localized Water Cooled Cold Plate 419k

Paper (PDF)