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Technical Papers
March 2012
Advanced Cooling for Power Electronics
Paper (PDF)
April 2011
Cooling to keep your Key Chips Alive
Paper (PDF)
Presentation (PDF)
Fall 2010
Evaluation of Cooling Solutions for Outdoor Electronics. Electronics Cooling Magazine, Volume 16, Number 3
Paper (PDF)
June 2010
Computational Method for Generalized Analysis of Pumped Two-Phase Cooling Systems and its Application to a System Used in Data-Center Environments. Proceedings of ITherm 2010 Conference
Paper (PDF)
July 2008
Flat Plate Evaporator for Electronic Cooling. 6th International Energy Conversion Engineering Conference, Cleveland, Ohio, USA
Paper (PDF)
May 2008
Loop Heat Pipe Technology for Cooling Computer Servers. Proceedings of ITherm 2008 Conference
Paper (PDF)
September 2007
Evaluation of Cooling Solutions for Outdoor Electronics. Proceedings of Therminic 2007 Conference, Budapest, Hungary
Paper (PDF)
July 2007
Read about the latest cooling technologies for high heat flux applications in this paper given by Aavid's chief technology officer Sukhvinder Kang at InterPACK 2007 in Vancouver.
CLOSED LOOP LIQUID COOLING FOR HIGH PERFORMANCE COMPUTER
SYSTEMS
Paper (PDF)
July 2007
Surface Mount Technology Cooling for High Volume Applications. SIA-APE Conference, Paris, France
Paper (PDF)
June 2006
Effect Of Obstruction Near Fan Inlet On Fan Heat Sink Performance. Proceedings of Itherm 2006 Conference, San Diego, California, USA
Paper (PDF)
July 2005
Testing the Thermal Resistance and Power Capacity of Production Heat Pipes. Proceedings of IPACK 2005, San Francisco, California, USA
Paper (PDF)
July 2005
Computational Method for Characterization of a Microchannel Heat Sink Involving Two-Phase Flow. Proceedings of IPACK 2005, San Francisco, California, USA 2.6 mb
Paper (PDF)
July 2005
Bonding and Brazing Technologies for Power Electronic Cooling – When and Why
Paper (PDF)
July 2004
Blister Liquid Cold Plates–Production Technology; Thermal Performances Analysis and Application Comparisons. PCIM, Nuremberg, Germany
Paper (PDF)
June 2004
Board Level Thermal Analysis via Large Eddy Simulation (LES) Tool. Proceedings of ITherm 2004 Conference
Paper (PDF)
July 2003
Advanced Cooling Methods for High Power Density in Electronics
Paper (PDF)
July 2003
The Thermal Resistance of Pin Fin Heat Sinks in Transverse Flow. Proceedings of IPACK 2003, Maui, Hawaii, USA
Paper (PDF)
April 2003
Learn about some of the latest cooling solutions offered by Aavid Thermalloy for all new modules with high power density.
Paper (PDF)
June 2002
A Simplified CFD Model for the Radial Blower. Proceedings of ITherm 2002 Conference, San Diego, California, USA
Paper (PDF)
June 2001
High Performance SOI/Cu SRAMs and Memories in Microprocessors. Advanced Interconnect Conference, Montreal, Canada
Paper (PDF)
Analytical Model for Simulating the Thermal Behavior of Microelectronic Systems 361k
Paper (PDF)
Analytical Modeling of Thermal Resistance in Bolted Joints 267k
Paper (PDF)
Closed-Form Equation for Thermal Constriction/Spreading Resistances with Variable Resistance Boundary Condition 367k
Paper (PDF)
Constriction/Spreading Resistance Model for Electronics Packaging 425k
Paper (PDF)
How to Select a Heat Sink 212k
Paper (PDF)
Optimum Design and Selection of Heat Sinks 249k
Paper (PDF)
Thermal Modeling of Isothermal Cuboids and Rectangular Heat Sinks Cooled by Natural Convection 316k
Paper (PDF)
Thermal Performance of an Elliptical Pin Fin Heat Sink 317k
Paper (PDF)
Thermal Performance of Interface Material in Microelectronics Packaging Applications
Paper (PDF)
Thermal Performance Modeling and Measurements of Localized Water Cooled Cold Plate 419k
Paper (PDF)
Advanced Cooling for Power Electronics
Paper (PDF)
April 2011
Cooling to keep your Key Chips Alive
Paper (PDF)
Presentation (PDF)
Fall 2010
Evaluation of Cooling Solutions for Outdoor Electronics. Electronics Cooling Magazine, Volume 16, Number 3
Paper (PDF)
June 2010
Computational Method for Generalized Analysis of Pumped Two-Phase Cooling Systems and its Application to a System Used in Data-Center Environments. Proceedings of ITherm 2010 Conference
Paper (PDF)
July 2008
Flat Plate Evaporator for Electronic Cooling. 6th International Energy Conversion Engineering Conference, Cleveland, Ohio, USA
Paper (PDF)
May 2008
Loop Heat Pipe Technology for Cooling Computer Servers. Proceedings of ITherm 2008 Conference
Paper (PDF)
September 2007
Evaluation of Cooling Solutions for Outdoor Electronics. Proceedings of Therminic 2007 Conference, Budapest, Hungary
Paper (PDF)
July 2007
Read about the latest cooling technologies for high heat flux applications in this paper given by Aavid's chief technology officer Sukhvinder Kang at InterPACK 2007 in Vancouver.
CLOSED LOOP LIQUID COOLING FOR HIGH PERFORMANCE COMPUTER
SYSTEMSPaper (PDF)
July 2007
Surface Mount Technology Cooling for High Volume Applications. SIA-APE Conference, Paris, France
Paper (PDF)
June 2006
Effect Of Obstruction Near Fan Inlet On Fan Heat Sink Performance. Proceedings of Itherm 2006 Conference, San Diego, California, USA
Paper (PDF)
July 2005
Testing the Thermal Resistance and Power Capacity of Production Heat Pipes. Proceedings of IPACK 2005, San Francisco, California, USA
Paper (PDF)
July 2005
Computational Method for Characterization of a Microchannel Heat Sink Involving Two-Phase Flow. Proceedings of IPACK 2005, San Francisco, California, USA 2.6 mb
Paper (PDF)
July 2005
Bonding and Brazing Technologies for Power Electronic Cooling – When and Why
Paper (PDF)
July 2004
Blister Liquid Cold Plates–Production Technology; Thermal Performances Analysis and Application Comparisons. PCIM, Nuremberg, Germany
Paper (PDF)
June 2004
Board Level Thermal Analysis via Large Eddy Simulation (LES) Tool. Proceedings of ITherm 2004 Conference
Paper (PDF)
July 2003
Advanced Cooling Methods for High Power Density in Electronics
Paper (PDF)
July 2003
The Thermal Resistance of Pin Fin Heat Sinks in Transverse Flow. Proceedings of IPACK 2003, Maui, Hawaii, USA
Paper (PDF)
April 2003
Learn about some of the latest cooling solutions offered by Aavid Thermalloy for all new modules with high power density.
Paper (PDF)
June 2002
A Simplified CFD Model for the Radial Blower. Proceedings of ITherm 2002 Conference, San Diego, California, USA
Paper (PDF)
June 2001
High Performance SOI/Cu SRAMs and Memories in Microprocessors. Advanced Interconnect Conference, Montreal, Canada
Paper (PDF)
Analytical Model for Simulating the Thermal Behavior of Microelectronic Systems 361k
Paper (PDF)
Analytical Modeling of Thermal Resistance in Bolted Joints 267k
Paper (PDF)
Closed-Form Equation for Thermal Constriction/Spreading Resistances with Variable Resistance Boundary Condition 367k
Paper (PDF)
Constriction/Spreading Resistance Model for Electronics Packaging 425k
Paper (PDF)
How to Select a Heat Sink 212k
Paper (PDF)
Optimum Design and Selection of Heat Sinks 249k
Paper (PDF)
Thermal Modeling of Isothermal Cuboids and Rectangular Heat Sinks Cooled by Natural Convection 316k
Paper (PDF)
Thermal Performance of an Elliptical Pin Fin Heat Sink 317k
Paper (PDF)
Thermal Performance of Interface Material in Microelectronics Packaging Applications
Paper (PDF)
Thermal Performance Modeling and Measurements of Localized Water Cooled Cold Plate 419k
Paper (PDF)
